Home > AOI Tester >

AOI Semiconductor wire bonding inspection for die bonding machine and track design

Product Categories

3D AOI Machine [32]
AOI Tester [30]
AOI Inspection Equipment [23]
AOI PCB Machine [21]
Automated Optical Inspection Machine [21]
SMT AOI Machine [45]
LED AOI Equipment [18]

Dongguan MENTO Intelligent Technology Co., Ltd.

Contact Now

AOI Semiconductor wire bonding inspection for die bonding machine and track design

Name: AOI Semiconductor wire bonding inspection for die bonding machine and track design
Brand: MENTO
Price: 1 USD

Quality AOI Semiconductor wire bonding inspection for die bonding machine and track design wholesale

Brand Name : MENTO

Model Number : S2020

Certification : FCC.ROHS,CCC

Place of Origin : DONGGUAN

MOQ : 1

Supply Ability : 10pcs+20 work days

Delivery Time : 20 work days

Packaging Details : 1200mm*1500mm*1800mm

Inspection Type : 2D and 3D

Lighting Source : UV and white light

Inspection Accuracy : ±3μm

Inspection Resolution : 10μm

Power Supply : AC 100-240V, 50/60Hz

Software Platform : Windows

Inspection Range : Up to 510mm x 510mm

Dimensions : 1000mm x 1000mm x 1500mm

Usage : Automated Optical Inspection

Inspection Speed : Up to 1200mm/s

Lighting Type : LED

Contact Now

S2020 Semiconductor wire bonding inspection

Device model		S2020
Detection capacity	Detection items	Wire bonding inspection
	Detection type	Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving
Optical system	Camera	20MP
	Telecentric lens	telecentric optical lens
	Resolution	4um(2.4um~4um optional)
	illuminant	RGB(can be customized)
	Efficiency	3FOV/s
Software system	Operating system	Ubuntu
Computer configuration	Host	CPU: Inteli7, RAM: DDR4-128G, GPU: GTX1660-6GB SSD:250G, HDD: 2T
	Monitor	22"LED
	Operating system	Ubuntu
Detection performance	PCB Thickness	1~5mm
	Component Height	20mm upper, 30mm lower (special height can be customized)
	Driving equipment	Linear motor + grating ruler
	Moving speed	Max:600mm/s
	PCB transport rail	900+20mm (from the ground to the fixture surface)
Parameters	PCB size	Max:350mmx300mm	Max:370mmx350mm
	Power	AC220V/50Hz/2000W
	Overall size	W1120xD980xH1600 mm
	Weight	≈800KG
	Air pressure requirements	≥0.5Mpa
	Environmental requirements	Temperature: 5~40℃, relative humidity 25%~80% (no frost)
	Upstream and downstream equipment communication	Standard SMEMA interface/data communication with die bonding machine

Scientific platform design

Grinding grade motion track design

High repeatability and positioning accuracy, low noise

High-precision motion control system design

Avoid motion system data loss, ensure high-speed and stable operation, and effectively improve motion acceleration and deceleration.

Overall casting structure

Effectively ensure the stability of the continuous operation of the equipment.

Inspection Items

Gold Wire Inspection:Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving.

Core inspection: offset, rotation, particle, scratches, reverse and so on.

AOI Semiconductor wire bonding inspection for die bonding machine and track design

Product Tags:

AOI Semiconductor wire bonding inspection

AOI Semiconductor wire bonding inspection for die bonding machine and track design Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan MENTO Intelligent Technology Co., Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!